LB Semicon, Inc.
061970
Rank in Stocks
#19273
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Share Price
$2.31
Market Cap
$161.61M
Change (1 day)
-4.99%
Change (1 year)
-40.21%
Country
KR
Trade LB Semicon, Inc. (061970)
Category
Technology
Dividend history for LB Semicon, Inc. (061970)
LB Semicon, Inc. (stock symbol: 061970) made a total of 0 dividend payments.
The sum of all dividends (adjusted for stock splits) is : 0.00
Dividend yield (TTM) : 0
The sum of all dividends (adjusted for stock splits) is : 0.00
Dividend yield (TTM) : 0
Dividend payments for LB Semicon, Inc. (061970) from 2026 to 2026
Annual dividend payments
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List of all dividend payments
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Dividend payments for similar companies or competitors
| Company | Number of dividend payments | Country |
|---|---|---|
| 53.00% |
US
|
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| 44.00% |
TW
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| 61.00% |
US
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| 31.00% |
US
|
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| 1.00% |
US
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