LB Semicon, Inc.
061970
Rank in Stocks
#19238
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Share Price
$2.28
Market Cap
$159.92M
Change (1 day)
-5.98%
Change (1 year)
-40.84%
Country
KR
Trade LB Semicon, Inc. (061970)
Category
Technology
Earnings for LB Semicon, Inc. (061970)
Earnings in 2026 TTM: 0
According to LB Semicon, Inc. latest financial reports the company's current earnings are 0. In 2026 the company made an earning of 0, equal to its 2026 earnings that were of 0. The earnings displayed on this page are the earnings before interest and taxes or simply EBIT.
Earnings history for LB Semicon, Inc. from 2026 to 2026
Earnings at the end of each year
| Year | Earnings | Change |
|---|---|---|
| Not enough data for the provided dates. | ||
Earnings for similar companies or competitors
| Company | Earnings | Earnings Difference | Country |
|---|---|---|---|
| $229.74B | - |
US
|
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| $84.84B | - |
TW
|
|
| $40.47B | - |
US
|
|
| $99.73B | - |
US
|
|
| $7.56B | - |
US
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