LB Semicon, Inc.
061970
Rank in Stocks
#19169
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Share Price
$2.31
Market Cap
$161.86M
Change (1 day)
1.21%
Change (1 year)
-37.84%
Country
KR
Trade LB Semicon, Inc. (061970)
Category
Technology
Revenue for LB Semicon, Inc. (061970)
Revenue in Oct 2026 TTM: 0
According to LB Semicon, Inc. latest financial reports the company's current revenue (TTM) is 0. In 2026 the company made a revenue of 0 equal to the revenue in the year 2026 that was 0. The revenue is the total amount of income that a company generates by the sale of goods or services. Unlike with the earnings no expenses are subtracted.
Revenue history for LB Semicon, Inc. from 2026 to 2026
Revenue at the end of each year
| Year | Revenue | Change |
|---|---|---|
| Not enough data for the provided dates. | ||
Revenue for similar companies or competitors
| Company | Revenue | Revenue Difference | Country |
|---|---|---|---|
| $302.97B | - |
US
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| $141.20B | - |
TW
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| $89.10B | - |
US
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| $133.19B | - |
US
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| $41.31B | - |
US
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