Chipbond Technology Corporation
6147
Rank in Stocks
#3489
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Share Price
$6.63
Market Cap
$4.94B
Change (1 day)
0.24%
Change (1 year)
254.50%
Country
TW
Trade Chipbond Technology Corporation (6147)
Category
Technology
P/E ratio for Chipbond Technology Corporation (6147)
P/E ratio as of October 2026 TTM: 51.56
According to Chipbond Technology Corporation latest financial reports and stock price the company's current price-to-earnings ratio (TTM) is 51.56. At the end of 2023 the company had a P/E ratio of 13.36.
P/E ratio history for Chipbond Technology Corporation from 2006 to 2026
P/E ratio at the end of each year
| Year | P/E Ratio | Change |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
P/E ratio for similar companies or competitors
| Company | P/E Ratio | P/E Ratio Difference | Country |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
How to read a P/E ratio?
The Price/Earnings ratio measures the relationship between a company's stock price and its earnings per share.
A low but positive P/E ratio stands for a company that is generating high earnings compared to its current valuation and might be undervalued. A company with a high negative (near 0) P/E ratio stands for a company that is generating heavy losses compared to its current valuation.
Companies with a P/E ratio over 30 or a negative one are generaly seen as "growth stocks" meaning that investors typically expect the company to grow or to become profitable in the future.
Companies with a positive P/E ratio bellow 10 are generally seen as "value stocks" meaning that the company is already very profitable and unlikely to strong growth in the future.