Chipbond Technology Corporation
6147
Rank in Stocks
#3490
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Share Price
$6.63
Market Cap
$4.94B
Change (1 day)
0.24%
Change (1 year)
254.50%
Country
TW
Trade Chipbond Technology Corporation (6147)
Category
Technology
Number of shares outstanding for Chipbond Technology Corporation (6147)
Number of shares outstanding as of June 2026: 741.76M
According to Chipbond Technology Corporation latest financial reports and stock price the company's current number of shares outstanding is 741.76M. At the end of December 2023 the company had 738.38M shares outstanding. The number of outstanding shares is usually impacted by stock plits and shares buy back.
Shares outstanding history for Chipbond Technology Corporation (6147) from 2006 to 2026
Shares Outstanding at the end of each year
| Year | Shares Outstanding | Change |
|---|---|---|
| 2026 (TTM) | 741.76M | 0.32% |
| 2024 | 739.42M | 0.14% |
| 2023 | 738.38M | -0.04% |
| 2022 | 738.68M | 8.31% |
| 2021 | 682.01M | 4.43% |
| 2020 | 653.07M | 0.27% |
| 2019 | 651.34M | 0.23% |
| 2018 | 649.84M | 0.09% |
| 2017 | 649.26M | 0.00% |
| 2016 | 649.26M | 0.30% |
| 2015 | 647.31M | 0.31% |
| 2014 | 645.31M | 6.79% |
| 2013 | 604.31M | 2.58% |
| 2012 | 589.09M | -0.37% |
| 2011 | 591.26M | 13.05% |
| 2010 | 523.02M | 66.82% |
| 2009 | 313.52M | -1.63% |
| 2008 | 318.70M | -0.58% |
| 2007 | 320.56M | 4.69% |
| 2006 | 306.22M | 0.00% |
Shares Outstanding for similar companies or competitors
| Company | Shares Outstanding | Difference | Country |
|---|---|---|---|
| 24.19B | 3,161.15% |
US
|
|
| 25.93B | 3,395.69% |
TW
|
|
| 4.77B | 542.52% |
US
|
|
| 1.13B | 52.34% |
US
|
|
| 1.63B | 119.88% |
US
|
