Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

Rank in Stocks #1394
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Share Price
$30.21
Market Cap
$15.92B
Change (1 day)
-3.26%
Change (1 year)
512.31%
Country
TW
Trade Kinsus Interconnect Technology Corp. (3189)

Category

Technology
Number of shares outstanding for Kinsus Interconnect Technology Corp. (3189)
Number of shares outstanding as of June 2026: 655.65M
According to Kinsus Interconnect Technology Corp. latest financial reports and stock price the company's current number of shares outstanding is 655.65M. At the end of December 2024 the company had 453.76M shares outstanding. The number of outstanding shares is usually impacted by stock plits and shares buy back.
Shares outstanding history for Kinsus Interconnect Technology Corp. (3189) from 2004 to 2026
Shares Outstanding at the end of each year
Year Shares Outstanding Change
2026 (TTM) 655.65M 44.02%
2025 455.24M 0.33%
2024 453.76M -4.50%
2023 475.16M 2.64%
2022 462.96M 14.73%
2021 403.53M -10.64%
2020 451.60M 0.81%
2019 447.96M -0.02%
2018 448.06M 0.24%
2017 446.98M -0.95%
2016 451.25M -0.86%
2015 455.16M 0.41%
2014 453.30M 0.11%
2013 452.82M -0.04%
2012 453.01M 1.57%
2011 446.00M 0.00%
2010 446.00M 0.00%
2009 446.00M 0.00%
2008 446.00M 0.00%
2007 446.00M 8.44%
2006 411.30M 19.34%
2005 344.64M 5.72%
2004 325.98M 0.00%
Shares Outstanding for similar companies or competitors
Company Shares Outstanding Difference Country
24.19B 3,589.48%
US
25.93B 3,854.83%
TW
4.77B 626.91%
US
1.13B 72.35%
US
1.63B 148.76%
US