Kinsus Interconnect Technology Corp.
3189
Rank in Stocks
#1384
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Share Price
$30.62
Market Cap
$16.14B
Change (1 day)
-3.70%
Change (1 year)
521.31%
Country
TW
Trade Kinsus Interconnect Technology Corp. (3189)
Category
Technology
Dividend history for Kinsus Interconnect Technology Corp. (3189)
Kinsus Interconnect Technology Corp. (stock symbol: 3189) made a total of 21 dividend payments.
The sum of all dividends (adjusted for stock splits) is : $53.68
Dividend yield (TTM) : 0.0015
The sum of all dividends (adjusted for stock splits) is : $53.68
Dividend yield (TTM) : 0.0015
Dividend payments for Kinsus Interconnect Technology Corp. (3189) from 2005 to 2026
Annual dividend payments
| Year | Dividend (stock split adjusted) | Change |
|---|---|---|
| 2026 (TTM) | $1.00 | 0.00% |
| 2025 | $1.00 | 0.01% |
| 2024 | $1.00 | -84.56% |
| 2023 | $6.48 | 43.90% |
| 2022 | $4.50 | 350.00% |
| 2021 | $1.00 | -0.04% |
| 2020 | $1.00 | -33.27% |
| 2019 | $1.50 | -0.06% |
| 2018 | $1.50 | -50.00% |
| 2017 | $3.00 | -14.29% |
| 2016 | $3.50 | -12.50% |
| 2015 | $4.00 | 14.29% |
| 2014 | $3.50 | 16.67% |
| 2013 | $3.00 | 0.00% |
| 2012 | $3.00 | 0.00% |
| 2011 | $3.00 | 30.43% |
| 2010 | $2.30 | 15.00% |
| 2009 | $2.00 | -49.75% |
| 2008 | $3.98 | 46.67% |
| 2007 | $2.71 | 164.49% |
| 2006 | $1.03 | 50.66% |
| 2005 | $0.681 | 0.00% |
List of all dividend payments
| Year | Dividend | Change |
|---|---|---|
| 2026 (TTM) | $1.00 | 0.00% |
| 2025 | $1.00 | 0.01% |
| 2024 | $1.00 | -84.56% |
| 2023 | $6.48 | 43.90% |
| 2022 | $4.50 | 350.00% |
| 2021 | $1.00 | -0.04% |
| 2020 | $1.00 | -33.27% |
| 2019 | $1.50 | -0.06% |
| 2018 | $1.50 | -50.00% |
| 2017 | $3.00 | -14.29% |
| 2016 | $3.50 | -12.50% |
| 2015 | $4.00 | 14.29% |
| 2014 | $3.50 | 16.67% |
| 2013 | $3.00 | 0.00% |
| 2012 | $3.00 | 0.00% |
| 2011 | $3.00 | 30.43% |
| 2010 | $2.30 | 15.00% |
| 2009 | $2.00 | -49.75% |
| 2008 | $3.98 | 46.67% |
| 2007 | $2.71 | 164.49% |
| 2006 | $1.03 | 6.33% |
| 2005 | $0.9649 | 0.00% |
Dividend payments for similar companies or competitors
| Company | Number of dividend payments | Country |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
