HPSP Co., Ltd.
403870
Rank in Stocks
#5034
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Share Price
$35.20
Market Cap
$2.86B
Change (1 day)
-2.86%
Change (1 year)
37.95%
Country
KR
Trade HPSP Co., Ltd. (403870)
Category
Technology
Dividend history for HPSP Co., Ltd. (403870)
HPSP Co., Ltd. (stock symbol: 403870) made a total of 4 dividend payments.
The sum of all dividends (adjusted for stock splits) is : $937.50
Dividend yield (TTM) : 0.012
The sum of all dividends (adjusted for stock splits) is : $937.50
Dividend yield (TTM) : 0.012
Dividend payments for HPSP Co., Ltd. (403870) from 2022 to 2026
Annual dividend payments
| Year | Dividend (stock split adjusted) | Change |
|---|---|---|
| 2026 (TTM) | $600.00 | 0.00% |
| 2025 | $600.00 | 300.00% |
| 2024 | $150.00 | 300.00% |
| 2023 | $37.50 | -75.00% |
| 2022 | $150.00 | 0.00% |
List of all dividend payments
| Year | Dividend | Change |
|---|---|---|
| 2026 (TTM) | $600.00 | 0.00% |
| 2025 | $600.00 | 300.00% |
| 2024 | $150.00 | 300.00% |
| 2023 | $37.50 | -93.75% |
| 2022 | $600.00 | 0.00% |
Dividend payments for similar companies or competitors
| Company | Number of dividend payments | Country |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
