Shenzhen Sunway Communication Co., Ltd.
300136
Rank in Stocks
#2888
Established in Shenzhen, China, in 2006, Shenzhen Sunway Communication Co.,... Established in Shenzhen, China, in 2006, Shenzhen Sunway Communication Co., Ltd. specializes in the innovation, production, and global distribution of a wide array of advanced electronic components. The company's extensive product portfolio includes various types of antennas, modern wireless charging modules, and crucial soft magnetic materials. They also develop and manufacture radio frequency (RF) front-end components, a comprehensive range of cables (such as RF and active optical cables) and connectors, alongside audio and RF modules. Furthermore, Sunway provides specialized solutions for electromagnetic compatibility (EMC) and interference (EMI). Their offerings extend to precision-engineered metal and plastic components, structural assemblies, and a variety of passive electronic parts like alloy, thick-film, thin-film, and ceramic chip resistors. Integrated antenna speaker assemblies, designed for speakers, speaker boxes, and receivers, are also a key part of their production. These sophisticated solutions are vital for numerous applications across several industries, including consumer electronics (such as smartphones, tablets, personal computers, and smart wearable devices), the automotive sector, the Internet of Things (IoT), smart home systems, and essential communication infrastructure.
Share Price
$6.63
Market Cap
$6.39B
Change (1 day)
5.69%
Change (1 year)
68.15%
Country
CN
Trade Shenzhen Sunway Communication Co., Ltd. (300136)
Category
Technology
Dividend history for Shenzhen Sunway Communication Co., Ltd. (300136)
Shenzhen Sunway Communication Co., Ltd. (stock symbol: 300136) made a total of 12 dividend payments.
The sum of all dividends (adjusted for stock splits) is : $0.64
Dividend yield (TTM) : 0.0011
The sum of all dividends (adjusted for stock splits) is : $0.64
Dividend yield (TTM) : 0.0011
Dividend payments for Shenzhen Sunway Communication Co., Ltd. (300136) from 2011 to 2026
Annual dividend payments
| Year | Dividend (stock split adjusted) | Change |
|---|---|---|
| 2026 (TTM) | $0.05 | 0.00% |
| 2025 | $0.05 | -50.00% |
| 2024 | $0.1 | 100.00% |
| 2023 | $0.05 | 0.00% |
| 2022 | $0.05 | -50.00% |
| 2021 | $0.1 | 100.00% |
| 2020 | $0.05 | -37.50% |
| 2018 | $0.08 | 60.00% |
| 2017 | $0.05 | 59.74% |
| 2016 | $0.0313 | 0.00% |
| 2015 | $0.0313 | 33.76% |
| 2012 | $0.0234 | 0.00% |
| 2011 | $0.0234 | 0.00% |
List of all dividend payments
| Year | Dividend | Change |
|---|---|---|
| 2026 (TTM) | $0.05 | 0.00% |
| 2025 | $0.05 | -50.00% |
| 2024 | $0.1 | 100.00% |
| 2023 | $0.05 | 0.00% |
| 2022 | $0.05 | -50.00% |
| 2021 | $0.1 | 100.00% |
| 2020 | $0.05 | -37.50% |
| 2018 | $0.08 | 60.00% |
| 2017 | $0.05 | 0.00% |
| 2016 | $0.05 | -50.00% |
| 2015 | $0.1 | -33.33% |
| 2012 | $0.15 | -50.00% |
| 2011 | $0.3 | 0.00% |
Dividend payments for similar companies or competitors
| Company | Number of dividend payments | Country |
|---|---|---|
| 85.00% |
US
|
|
| 0.00% |
JP
|
|
| 26.00% |
TW
|
|
| 154.00% |
US
|
|
| 28.00% |
TW
|
