Hwatsing Technology Co., Ltd.
688120
Rank in Stocks
#1375
Hwatsing Technology Co., Ltd. engages in the research, development, production,... Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Share Price
$31.17
Market Cap
$15.94B
Change (1 day)
-3.19%
Change (1 year)
119.50%
Country
CN
Trade Hwatsing Technology Co., Ltd. (688120)
Category
Technology
Dividend history for Hwatsing Technology Co., Ltd. (688120)
Hwatsing Technology Co., Ltd. (stock symbol: 688120) made a total of 4 dividend payments.
The sum of all dividends (adjusted for stock splits) is : $1.09
Dividend yield (TTM) : 0.0019
The sum of all dividends (adjusted for stock splits) is : $1.09
Dividend yield (TTM) : 0.0019
Dividend payments for Hwatsing Technology Co., Ltd. (688120) from 2023 to 2026
Annual dividend payments
| Year | Dividend (stock split adjusted) | Change |
|---|---|---|
| 2026 (TTM) | $0.4 | 51.69% |
| 2025 | $0.2637 | 0.00% |
| 2024 | $0.2637 | 63.89% |
| 2023 | $0.1609 | 0.00% |
List of all dividend payments
| Year | Dividend | Change |
|---|---|---|
| 2026 (TTM) | $0.56 | 51.72% |
| 2025 | $0.3691 | 0.00% |
| 2024 | $0.3691 | 63.90% |
| 2023 | $0.2252 | 0.00% |
Dividend payments for similar companies or competitors
| Company | Number of dividend payments | Country |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
