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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Rank in Stocks #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Share Price
$0.48016532
Last synced: 2026-08-21
Market Cap
$87.70M
Change (1 day)
1.34%
Change (1 year)
11.79%
Country
TW
Trade Taiwan IC Packaging Corporation (3372)

Category

Technology
Dividend yield history for Taiwan IC Packaging Corporation (3372)
Taiwan IC Packaging Corporation (stock symbol: 3372) dividend yield (TTM) as of 2026: 0
Average dividend yield, last 5 years : 0.00%
Dividend yield history for Taiwan IC Packaging Corporation (3372) from 2026 to 2026
Dividend Yield at the end of each year (TTM)
Year Dividend Yield Change
Not enough data for the provided dates.
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