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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
Rank in Stocks #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
Share Price
$5.93
Last synced: 2026-08-28
Market Cap
$808.10M
Change (1 day)
5.67%
Change (1 year)
76.93%
Country
TW
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Stock split history for Winstek Semiconductor Co., Ltd. (3265)
Winstek Semiconductor Co., Ltd. stock (symbol: 3265) underwent a total of 0 stock splits.
The most recent stock split occurred on Aug 30, 2026.
One 3265 share bought prior to Aug 30, 2026 would equal to 0 3265 shares today.
Stock split list
Year Split Multiple Cumulative Multiple
Not enough data for the provided dates.
Stock splits for similar companies or competitors
Company Number of stock splits Cumulative Multiple Country
6 x480
US
11 x12
TW
1 x10
US
3 x10
US
1 x0
KR