Chipbond Technology Corporation
6147
Xếp hạng trong cổ phiếu
#3586
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Giá cổ phiếu
$6.41
Vốn hóa thị trường
$4.77B
Thay đổi (1 ngày)
-3.36%
Thay đổi (1 năm)
237.54%
Quốc gia
TW
Giao dịch Chipbond Technology Corporation (6147)
Danh mục
Technology
Lịch sử chia tách cổ phiếu của Chipbond Technology Corporation (6147)
Cổ phiếu Chipbond Technology Corporation (mã: 6147) đã trải qua tổng cộng 3 lần chia tách.
Lần chia tách gần nhất diễn ra vào ngày Aug 05, 2008.
Một cổ phiếu 6147 mua trước ngày Aug 08, 2006 hiện tương đương với 1.0891166688 cổ phiếu 6147.
Lần chia tách gần nhất diễn ra vào ngày Aug 05, 2008.
Một cổ phiếu 6147 mua trước ngày Aug 08, 2006 hiện tương đương với 1.0891166688 cổ phiếu 6147.
Danh sách chia tách cổ phiếu
| Năm | Chia tách | Tỷ lệ | Tỷ lệ cộng dồn |
|---|---|---|---|
| 2008-08-05 | 25569:25000 | x1.02276 | x1.0891166688 |
| 2007-08-07 | 51:50 | x1.02 | x1.06488 |
| 2006-08-08 | 261:250 | x1.044 | x1.044 |
Chia tách cổ phiếu của các công ty tương tự hoặc đối thủ
| Công ty | Số lần chia tách cổ phiếu | Tỷ lệ cộng dồn | Quốc gia |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
