Chipbond Technology Corporation
6147
Xếp hạng trong cổ phiếu
#3572
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Giá cổ phiếu
$6.41
Vốn hóa thị trường
$4.77B
Thay đổi (1 ngày)
-3.36%
Thay đổi (1 năm)
237.54%
Quốc gia
TW
Giao dịch Chipbond Technology Corporation (6147)
Danh mục
Technology
Tỷ lệ P/B của Chipbond Technology Corporation (6147)
Tỷ lệ P/B vào October 2026 TTM: 2.72
Theo các báo cáo tài chính và giá cổ phiếu mới nhất của Chipbond Technology Corporation, tỷ lệ P/B hiện tại (TTM) là 2.72. Vào cuối năm 2023, công ty có P/B là 1.10.
Lịch sử tỷ lệ P/B của Chipbond Technology Corporation từ 2006 đến 2026
Tỷ lệ P/B vào cuối mỗi năm
| Năm | Tỷ lệ P/B | Thay đổi |
|---|---|---|
| 2026 (TTM) | 2.72 | 169.26% |
| 2024 | 1.01 | -8.25% |
| 2023 | 1.10 | 6.19% |
| 2022 | 1.04 | -5.00% |
| 2021 | 1.09 | -19.36% |
| 2020 | 1.35 | -8.18% |
| 2019 | 1.47 | 2.14% |
| 2018 | 1.44 | -3.48% |
| 2017 | 1.50 | 18.63% |
| 2016 | 1.26 | -4.01% |
| 2015 | 1.31 | -18.72% |
| 2014 | 1.62 | 25.45% |
| 2013 | 1.29 | -33.74% |
| 2012 | 1.94 | 81.80% |
| 2011 | 1.07 | -37.09% |
| 2010 | 1.70 | 12.09% |
| 2009 | 1.52 | 209.98% |
| 2008 | 0.49 | -69.44% |
| 2007 | 1.60 | 0.51% |
| 2006 | 1.59 | 0.00% |
Tỷ lệ P/B của các công ty tương tự hoặc đối thủ cạnh tranh
| Công ty | Tỷ lệ P/B | Chênh lệch Tỷ lệ P/B | Quốc gia |
|---|---|---|---|
| 23.3783 | 759.65% |
US
|
|
| 9.8357 | 261.67% |
TW
|
|
| 16.5536 | 508.70% |
US
|
|
| 7.4648 | 174.49% |
US
|
|
| 13.8493 | 409.26% |
US
|
