Chipbond Technology Corporation
6147
Xếp hạng trong cổ phiếu
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Giá cổ phiếu
$6.61
Đồng bộ lần cuối: 2026-10-16
Vốn hóa thị trường
$4.92B
Thay đổi (1 ngày)
-2.12%
Thay đổi (1 năm)
253.64%
Quốc gia
TW
Giao dịch Chipbond Technology Corporation (6147)
Danh mục
Technology
EPS của Chipbond Technology Corporation (6147)
EPS tính đến June 2026 TTM: $0.13
Theo các báo cáo tài chính mới nhất và giá cổ phiếu của Chipbond Technology Corporation, EPS hiện tại của công ty (TTM) là $0.13. Vào cuối năm 2023, công ty có EPS là $0.18, giảm so với EPS năm 2022 là $0.27.
Lịch sử EPS của Chipbond Technology Corporation từ 2006 đến 2026
EPS vào cuối mỗi năm
| Năm | EPS | Thay đổi |
|---|---|---|
| 2026 (TTM) | $0.13 | -22.18% |
| 2024 | $0.17 | -3.40% |
| 2023 | $0.18 | -35.73% |
| 2022 | $0.27 | -15.52% |
| 2021 | $0.32 | 62.59% |
| 2020 | $0.20 | -4.86% |
| 2019 | $0.21 | -7.66% |
| 2018 | $0.23 | 94.27% |
| 2017 | $0.12 | 23.68% |
| 2016 | $0.09 | -2.37% |
| 2015 | $0.10 | -22.23% |
| 2014 | $0.12 | -10.10% |
| 2013 | $0.14 | -7.04% |
| 2012 | $0.15 | 50.00% |
| 2011 | $0.10 | -36.49% |
| 2010 | $0.16 | 343.34% |
| 2009 | $0.04 | 364.47% |
| 2008 | $0.01 | -92.90% |
| 2007 | $0.11 | 53.74% |
| 2006 | $0.07 | 0.00% |
EPS cho các công ty hoặc đối thủ cạnh tranh tương tự
| Công ty | EPS | Chênh lệch EPS | Quốc gia |
|---|---|---|---|
| $7.95 | 5,909.07% |
US
|
|
| $2.74 | 1,973.54% |
TW
|
|
| $8.06 | 5,992.21% |
US
|
|
| $75.31 | 56,823.66% |
US
|
|
| $3.94 | 2,878.08% |
US
|
