Top Markets
#1 FGRS (Figure Tokenized Stock) FGRS (Figure Tokenized Stock) +24.27%
#2 MiL.k Alliance MiL.k Alliance +22.68%
#3 Biconomy Biconomy +20.40%
#4 The Black Bull The Black Bull +17.73%
#5 THORChain THORChain +17.53%
#6 Wrapped STX (Velar) Wrapped STX (Velar) +16.51%
#7 Tutorial Tutorial +13.02%
#8 THORChain Yield THORChain Yield +12.99%
#9 XPIN Network XPIN Network +12.89%
#10 MetaDAO MetaDAO +12.86%
Coin of the day
FGRS (Figure Tokenized Stock) FGRS (Figure Tokenized Stock)
Cài đặt
Ngôn ngữ
TIếNG VIệT
Tiền tệ
USD
Chủ đề
Xintec Inc. Xintec Inc.

Xintec Inc.

3374
Xếp hạng trong cổ phiếu #5073
Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading... Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading specialist in sophisticated wafer-level chip scale packaging (WLCSP) solutions. The company maintains a global presence, serving markets across Asia, the United States, and Europe. Its extensive range of services includes WLCSP for crucial components such as image and environmental sensors. Xintec also provides wafer-level post-passivation interconnection (WLPI) specifically designed for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF devices. Additionally, they offer comprehensive wafer testing services. For optical sensors, Xintec delivers advanced chip scale packaging, incorporating features like side-wall interconnects and through-silicon via (TSV) redistribution layer products. These solutions accommodate diverse glass thicknesses and filters, and include glass bonding to wafers, available with or without a cavity. The company is also proficient in various wafer reconstruction methods, including front-side, backside, and stack wafer reconstruction, catering to mobile, automotive, and consumer electronics applications. They further specialize in wafer reconstruction with a glass lid, particularly for the automotive sector. Moreover, Xintec offers highly specialized packaging services for micro-electromechanical systems (MEMS) sensors. This encompasses wafer thinning, precise partial dicing of bonded wafers to expose bonding pads, and CSP utilizing via-last TSV for connecting pads from the wafer surface to the backside. They also employ dry etching of silicon to form large cavities, enhancing product performance. Supplementary offerings include 3D I/O redistribution, power and ground enhancement, and dual-side connection capabilities. Xintec's cutting-edge technologies are integral to a wide array of electronic products, such as tablets, notebooks, computers, and medical equipment.
Giá cổ phiếu
$11.19
Vốn hóa thị trường
$3.04B
Thay đổi (1 ngày)
5.55%
Thay đổi (1 năm)
146.30%
Quốc gia
TW
Giao dịch Xintec Inc. (3374)

Danh mục

Technology
Lịch sử chia tách cổ phiếu của Xintec Inc. (3374)
Cổ phiếu Xintec Inc. (mã: 3374) đã trải qua tổng cộng 0 lần chia tách.
Lần chia tách gần nhất diễn ra vào ngày Aug 27, 2026.
Một cổ phiếu 3374 mua trước ngày Aug 27, 2026 hiện tương đương với 0 cổ phiếu 3374.
Danh sách chia tách cổ phiếu
Năm Chia tách Tỷ lệ Tỷ lệ cộng dồn
Không đủ dữ liệu cho ngày được cung cấp.
Chia tách cổ phiếu của các công ty tương tự hoặc đối thủ
Công ty Số lần chia tách cổ phiếu Tỷ lệ cộng dồn Quốc gia
NVIDIA Corporation NVIDIA Corporation
NVIDIA Corporation
NVDA.US
 6 x480
US
Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited
Taiwan Semiconductor Manufacturing Company Limited
2330.TW
 11 x12
TW
Broadcom Inc. Broadcom Inc.
Broadcom Inc.
AVGO.US
 1 x10
US
Micron Technology, Inc. Micron Technology, Inc.
Micron Technology, Inc.
MU.US
 3 x10
US
SK hynix Inc. SK hynix Inc.
SK hynix Inc.
000660.KS
 1 x0
KR