Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

Xếp hạng trong cổ phiếu #1331
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Giá cổ phiếu
$32.44
Vốn hóa thị trường
$17.09B
Thay đổi (1 ngày)
7.94%
Thay đổi (1 năm)
563.80%
Quốc gia
TW
Giao dịch Kinsus Interconnect Technology Corp. (3189)

Danh mục

Technology
Lịch sử chia tách cổ phiếu của Kinsus Interconnect Technology Corp. (3189)
Cổ phiếu Kinsus Interconnect Technology Corp. (mã: 3189) đã trải qua tổng cộng 4 lần chia tách.
Lần chia tách gần nhất diễn ra vào ngày Jul 24, 2007.
Một cổ phiếu 3189 mua trước ngày Jul 25, 2005 hiện tương đương với 1.46107281408 cổ phiếu 3189.
Danh sách chia tách cổ phiếu
Năm Chia tách Tỷ lệ Tỷ lệ cộng dồn
2007-07-24 11:10 x1.1 x1.46107281408
2006-08-02 140991:125000 x1.127928 x1.3282480128
2006-04-11 128:125 x1.024 x1.1776
2005-07-25 23:20 x1.15 x1.15
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