Kinsus Interconnect Technology Corp.
3189
Xếp hạng trong cổ phiếu
#1391
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Giá cổ phiếu
$30.21
Vốn hóa thị trường
$15.92B
Thay đổi (1 ngày)
-3.26%
Thay đổi (1 năm)
512.31%
Quốc gia
TW
Giao dịch Kinsus Interconnect Technology Corp. (3189)
Danh mục
Technology
Lịch sử lợi suất cổ tức của Kinsus Interconnect Technology Corp. (3189)
Lợi suất cổ tức (TTM) của Kinsus Interconnect Technology Corp. (mã cổ phiếu: 3189) tại thời điểm 2024-12-31 là: 0.99%
Lợi suất cổ tức trung bình trong 5 năm qua: 2.78%
Lợi suất cổ tức trung bình trong 5 năm qua: 2.78%
Lịch sử lợi suất cổ tức của Kinsus Interconnect Technology Corp. (3189) từ 2004 đến 2026
Lợi suất cổ tức vào cuối mỗi năm (TTM)
| Năm | Lợi suất cổ tức | Thay đổi |
|---|---|---|
| 2026 (TTM) | 0.15% | -100.00% |
| 2025 | 0.00% | -100.00% |
| 2024 | 0.99% | -86.57% |
| 2023 | 7.37% | 45.94% |
| 2022 | 5.05% | 952.08% |
| 2021 | 0.48% | -60.98% |
| 2020 | 1.23% | -57.73% |
| 2019 | 2.91% | -15.65% |
| 2018 | 3.45% | -36.81% |
| 2017 | 5.46% | 12.58% |
| 2016 | 4.85% | -17.24% |
| 2015 | 5.86% | 79.75% |
| 2014 | 3.26% | 9.03% |
| 2013 | 2.99% | -6.27% |
| 2012 | 3.19% | -14.48% |
| 2011 | 3.73% | 60.78% |
| 2010 | 2.32% | -0.85% |
| 2009 | 2.34% | -81.55% |
| 2008 | 12.68% | 391.47% |
| 2007 | 2.58% | 111.48% |
| 2006 | 1.22% | 69.44% |
| 2005 | 0.72% | -22.58% |
| 2004 | 0.93% | 0.00% |
Lợi suất cổ tức (TTM) của các công ty tương tự hoặc đối thủ
| Công ty | Lợi suất cổ tức | Quốc gia |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
