Winbond Electronics Corporation
2344
Xếp hạng trong cổ phiếu
#1041
Winbond Electronics Corporation is a global enterprise specializing in the... Winbond Electronics Corporation is a global enterprise specializing in the entire lifecycle of very large scale integration (VLSI) integrated circuits (ICs). This encompasses the design, development, manufacturing, and worldwide distribution of these components for a broad spectrum of microelectronic applications across Asia, the Americas, and Europe. The company organizes its operations into three primary product divisions: DRAM IC, Flash Memory, and Logic IC products. Its extensive portfolio features a diverse range of Dynamic Random-Access Memory (DRAM) devices. For mobile uses, these include pseudo static RAM (SRAM), HyperRAM, various low-power synchronous DRAM (SDR SDRAM), and double-data-rate (DDR) SDRAM standards (such as DDR1, DDR2, DDR3, and DDR4/4X), along with Known Good Die (KGD) formats. Furthermore, Winbond offers specialty DRAM units like standard SDRAM, DDR, DDR2, and DDR3 SDRAM, also available as KGD. In the realm of flash memory, the company provides solutions specifically for code storage, which consist of serial NOR flash, QspiNAND Flash, Single-Level Cell (SLC) NAND Flash, NAND-Based Multi-Chip Packages (MCP), SpiStack Flash NAND, and TrustME secure flash memory. Additionally, Winbond supplies a selection of logic integrated circuits. These sophisticated semiconductor components are integral to numerous high-technology sectors. Their widespread applications span computing, telecommunications, and general consumer electronics, extending to critical automotive and industrial control systems. They are also crucial for contemporary personal devices like smartphones, tablets, low-power mobile handhelds, and wearable technology, as well as the burgeoning Internet of Things (IoT). Further uses include powering personal computers and their associated peripherals, modules for mobile handheld devices, network communication equipment, and household appliance control units. Winbond markets its products through an established network of distributors and directly via online channels. Beyond its core manufacturing and sales, the company is deeply involved in comprehensive research, development, and design activities, providing dedicated post-sales support for its semiconductor and 6-inch wafer products. The corporation also operates in e-commerce, offers specialized testing services, serves as an Original Equipment Manufacturer (OEM), provides computer software services, and delivers expert consulting. Moreover, it includes a wholesale division for computer hardware, accessories, and software, in addition to handling project-specific sales. Established in 1987, Winbond Electronics Corporation maintains its principal corporate office in Taichung, Taiwan.
Giá cổ phiếu
$5.12
Vốn hóa thị trường
$23.04B
Thay đổi (1 ngày)
5.57%
Thay đổi (1 năm)
252.39%
Quốc gia
TW
Giao dịch Winbond Electronics Corporation (2344)
Danh mục
Technology
Lịch sử chia tách cổ phiếu của Winbond Electronics Corporation (2344)
Cổ phiếu Winbond Electronics Corporation (mã: 2344) đã trải qua tổng cộng 3 lần chia tách.
Lần chia tách gần nhất diễn ra vào ngày Oct 31, 2017.
Một cổ phiếu 2344 mua trước ngày May 24, 2000 hiện tương đương với 1.3423674 cổ phiếu 2344.
Lần chia tách gần nhất diễn ra vào ngày Oct 31, 2017.
Một cổ phiếu 2344 mua trước ngày May 24, 2000 hiện tương đương với 1.3423674 cổ phiếu 2344.
Danh sách chia tách cổ phiếu
| Năm | Chia tách | Tỷ lệ | Tỷ lệ cộng dồn |
|---|---|---|---|
| 2017-10-31 | 253:250 | x1.012 | x1.3423674 |
| 2001-05-15 | 239:200 | x1.195 | x1.32645 |
| 2000-05-24 | 111:100 | x1.11 | x1.11 |
Chia tách cổ phiếu của các công ty tương tự hoặc đối thủ
| Công ty | Số lần chia tách cổ phiếu | Tỷ lệ cộng dồn | Quốc gia |
|---|---|---|---|
| 6 | x480 |
US
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| 11 | x12 |
TW
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| 1 | x10 |
US
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| 3 | x10 |
US
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| 6 | x26 |
US
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