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Para birimi
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Tema
Xintec Inc. Xintec Inc.

Xintec Inc.

3374
Hisse Senetlerindeki Sıralama #5073
Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading... Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading specialist in sophisticated wafer-level chip scale packaging (WLCSP) solutions. The company maintains a global presence, serving markets across Asia, the United States, and Europe. Its extensive range of services includes WLCSP for crucial components such as image and environmental sensors. Xintec also provides wafer-level post-passivation interconnection (WLPI) specifically designed for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF devices. Additionally, they offer comprehensive wafer testing services. For optical sensors, Xintec delivers advanced chip scale packaging, incorporating features like side-wall interconnects and through-silicon via (TSV) redistribution layer products. These solutions accommodate diverse glass thicknesses and filters, and include glass bonding to wafers, available with or without a cavity. The company is also proficient in various wafer reconstruction methods, including front-side, backside, and stack wafer reconstruction, catering to mobile, automotive, and consumer electronics applications. They further specialize in wafer reconstruction with a glass lid, particularly for the automotive sector. Moreover, Xintec offers highly specialized packaging services for micro-electromechanical systems (MEMS) sensors. This encompasses wafer thinning, precise partial dicing of bonded wafers to expose bonding pads, and CSP utilizing via-last TSV for connecting pads from the wafer surface to the backside. They also employ dry etching of silicon to form large cavities, enhancing product performance. Supplementary offerings include 3D I/O redistribution, power and ground enhancement, and dual-side connection capabilities. Xintec's cutting-edge technologies are integral to a wide array of electronic products, such as tablets, notebooks, computers, and medical equipment.
Hisse Fiyatı
$11.19
Piyasa Değeri
$3.04B
Değişim (1 gün)
5.55%
Değişim (1 yıl)
146.30%
Ülke
TW
Ticaret Xintec Inc. (3374)

Kategori

Technology
Xintec Inc. (3374) için hisse senedi fiyat geçmişi
Gün sonu en yüksek fiyat: $10.10 - 2026-08-01

Gün sonu en düşük fiyat: $0.25 - 2005-06-01
Xintec Inc. için hisse fiyatı geçmişi: 2005 - 2026
Yıllık Hisse Fiyatı Performansı
Yıl Performans
2026 (TTM) 45.34%
2025 -29.39%
2024 48.80%
2023 24.59%
2022 -33.89%
2021 -20.36%
2020 151.67%
2019 114.78%
2018 -59.38%
2017 199.22%
2016 -8.02%
2015 -24.63%
2014 26.29%
2013 71.51%
2012 3.23%
2011 -59.11%
2010 1.92%
2009 195.38%
2008 -73.30%
2007 56.58%
2006 118.18%
2005 0.00%
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