Winbond Electronics Corporation Winbond Electronics Corporation

Winbond Electronics Corporation

2344

Hisse Senetlerindeki Sıralama #1029
Winbond Electronics Corporation is a global enterprise specializing in the... Winbond Electronics Corporation is a global enterprise specializing in the entire lifecycle of very large scale integration (VLSI) integrated circuits (ICs). This encompasses the design, development, manufacturing, and worldwide distribution of these components for a broad spectrum of microelectronic applications across Asia, the Americas, and Europe. The company organizes its operations into three primary product divisions: DRAM IC, Flash Memory, and Logic IC products. Its extensive portfolio features a diverse range of Dynamic Random-Access Memory (DRAM) devices. For mobile uses, these include pseudo static RAM (SRAM), HyperRAM, various low-power synchronous DRAM (SDR SDRAM), and double-data-rate (DDR) SDRAM standards (such as DDR1, DDR2, DDR3, and DDR4/4X), along with Known Good Die (KGD) formats. Furthermore, Winbond offers specialty DRAM units like standard SDRAM, DDR, DDR2, and DDR3 SDRAM, also available as KGD. In the realm of flash memory, the company provides solutions specifically for code storage, which consist of serial NOR flash, QspiNAND Flash, Single-Level Cell (SLC) NAND Flash, NAND-Based Multi-Chip Packages (MCP), SpiStack Flash NAND, and TrustME secure flash memory. Additionally, Winbond supplies a selection of logic integrated circuits. These sophisticated semiconductor components are integral to numerous high-technology sectors. Their widespread applications span computing, telecommunications, and general consumer electronics, extending to critical automotive and industrial control systems. They are also crucial for contemporary personal devices like smartphones, tablets, low-power mobile handhelds, and wearable technology, as well as the burgeoning Internet of Things (IoT). Further uses include powering personal computers and their associated peripherals, modules for mobile handheld devices, network communication equipment, and household appliance control units. Winbond markets its products through an established network of distributors and directly via online channels. Beyond its core manufacturing and sales, the company is deeply involved in comprehensive research, development, and design activities, providing dedicated post-sales support for its semiconductor and 6-inch wafer products. The corporation also operates in e-commerce, offers specialized testing services, serves as an Original Equipment Manufacturer (OEM), provides computer software services, and delivers expert consulting. Moreover, it includes a wholesale division for computer hardware, accessories, and software, in addition to handling project-specific sales. Established in 1987, Winbond Electronics Corporation maintains its principal corporate office in Taichung, Taiwan.
Hisse Fiyatı
$5.07
Piyasa Değeri
$22.82B
Değişim (1 gün)
4.59%
Değişim (1 yıl)
249.10%
Ülke
TW
Ticaret Winbond Electronics Corporation (2344)

Kategori

Technology
Winbond Electronics Corporation (2344) için gelir
Jun 2026 itibarıyla gelir TTM: $4.66B
Winbond Electronics Corporation şirketinin en son finansal raporlarına göre, mevcut geliri (TTM) $4.66B'dir. 2023 yılında şirketin geliri $2.44B önceki yıla göre azalma 2022 yılındaki $3.08B gelirine göre. Gelir, bir şirketin mal veya hizmet satışından elde ettiği toplam tutardır. Kazançtan farklı olarak, hiçbir gider düşülmez.
Winbond Electronics Corporation için 2006 ile 2026 arasındaki gelir geçmişi
Her yılın sonunda gelir
Yıl Gelir Değiştir
2026 (TTM) $4.66B 87.35%
2024 $2.49B 1.72%
2023 $2.44B -20.71%
2022 $3.08B -14.18%
2021 $3.59B 66.31%
2020 $2.16B 32.48%
2019 $1.63B -2.60%
2018 $1.67B 4.33%
2017 $1.60B 23.65%
2016 $1.30B 11.37%
2015 $1.17B -2.74%
2014 $1.20B 7.97%
2013 $1.11B -2.23%
2012 $1.13B -0.94%
2011 $1.15B -16.40%
2010 $1.37B 64.14%
2009 $834.87M 6.85%
2008 $781.32M -22.97%
2007 $1.01B -6.77%
2006 $1.09B 0.00%
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