LB Semicon, Inc.
061970
Hisse Senetlerindeki Sıralama
#18889
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Hisse Fiyatı
$2.37
Piyasa Değeri
$166.07M
Değişim (1 gün)
2.60%
Değişim (1 yıl)
-36.00%
Ülke
KR
Ticaret LB Semicon, Inc. (061970)
Kategori
Technology
LB Semicon, Inc. (061970) için hisse senedi fiyat geçmişi
Gün sonu en yüksek fiyat: $2.80 - 2026-10-01
Gün sonu en düşük fiyat: $4.06 - 2011-01-01
Gün sonu en düşük fiyat: $4.06 - 2011-01-01
LB Semicon, Inc. için hisse fiyatı geçmişi: 2011 - 2026
Yıllık Hisse Fiyatı Performansı
| Yıl | Performans |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Benzer şirketler veya rakiplerin hisse fiyatı
| Şirket | Hisse fiyatı | Değişim 1yıl% | Ülke |
|---|---|---|---|
| $213.23 | 18.28% |
US
|
|
| $73.94 | 55.79% |
TW
|
|
| $325.35 | -4.39% |
US
|
|
| $865.11 | 335.89% |
US
|
|
| $511.53 | 122.18% |
US
|
