Chipbond Technology Corporation
6147
Rankning i aktier
#3581
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Aktiekurs
$6.41
Marknadsvärde
$4.77B
Förändring (1 dag)
-3.36%
Förändring (1 år)
237.54%
Land
TW
Handel Chipbond Technology Corporation (6147)
Kategori
Technology
P/E-tal för Chipbond Technology Corporation (6147)
P/E-tal per October 2026 TTM: 51.56
Enligt Chipbond Technology Corporation senaste finansiella rapporter och aktiekurs är det aktuella P/E-talet (TTM) 51.56. I slutet av 2023 hade företaget ett P/E-tal på 13.36.
Historik för P/E-tal för Chipbond Technology Corporation från 2006 till 2026
P/E-tal vid slutet av varje år
| År | P/E-tal | Ändra |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
P/E-tal för liknande företag eller konkurrenter
| Företag | P/E-tal | Skillnad i P/E-tal | Land |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
Hur man läser ett P/E-tal
P/E-talet (Price/Earnings) mäter förhållandet mellan ett företags aktiekurs och dess vinst per aktie.
Ett lågt men positivt P/E visar ett företag med hög vinst i förhållande till värderingen och kan vara undervärderat. Ett högt negativt (nära 0) P/E indikerar stora förluster.
Företag med P/E över 30 eller negativt ses ofta som "tillväxtaktier", vilket innebär att investerare förväntar sig tillväxt eller framtida lönsamhet.
Företag med positivt P/E under 10 ses som "värdeaktier" och är redan lönsamma men med begränsad tillväxtpotential.