LB Semicon, Inc.
061970
Rankning i aktier
#19117
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Aktiekurs
$2.31
Marknadsvärde
$161.86M
Förändring (1 dag)
1.21%
Förändring (1 år)
-37.84%
Land
KR
Handel LB Semicon, Inc. (061970)
Kategori
Technology
Historik för aktiesplit för LB Semicon, Inc. (061970)
Aktien LB Semicon, Inc. (symbol: 061970) har genomgått totalt 0 aktiesplitar.
Den senaste spliten skedde den Oct 21, 2026.
En 061970-aktie köpt före Oct 21, 2026 motsvarar nu 0 061970-aktier.
Den senaste spliten skedde den Oct 21, 2026.
En 061970-aktie köpt före Oct 21, 2026 motsvarar nu 0 061970-aktier.
Lista över aktiesplitar
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Aktiesplitar för liknande företag eller konkurrenter
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