LB Semicon, Inc.
061970
Rankning i aktier
#18888
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Aktiekurs
$2.37
Marknadsvärde
$166.07M
Förändring (1 dag)
2.60%
Förändring (1 år)
-36.00%
Land
KR
Handel LB Semicon, Inc. (061970)
Kategori
Technology
Aktiekurshistorik för LB Semicon, Inc. (061970)
Högsta slutkurs: $2.80 den 2026-10-01
Lägsta slutkurs: $4.06 den 2011-01-01
Lägsta slutkurs: $4.06 den 2011-01-01
Aktiekurshistorik för LB Semicon, Inc. från 2011 till 2026
Årlig aktiekursutveckling
| År | Prestanda |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Aktiekurs för liknande företag eller konkurrenter
| Företag | Aktiekurs | Förändring 1år% | Land |
|---|---|---|---|
| $211.89 | 17.53% |
US
|
|
| $73.94 | 55.79% |
TW
|
|
| $322.23 | -5.31% |
US
|
|
| $852.58 | 329.58% |
US
|
|
| $503.78 | 118.81% |
US
|
