Chipbond Technology Corporation
6147
Ранг среди акций
#3570
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Цена акции
$6.41
Рыночная капитализация
$4.77B
Изменение (1 день)
-3.36%
Изменение (1 год)
237.54%
Страна
TW
Торговля Chipbond Technology Corporation (6147)
Категория
Technology
Коэффициент P/E для Chipbond Technology Corporation (6147)
Коэффициент P/E на October 2026 TTM: 51.56
Согласно последним финансовым отчетам и цене акций Chipbond Technology Corporation, текущий P/E (TTM) составляет 51.56. В конце 2023 у компании был P/E на уровне 13.36.
История P/E компании Chipbond Technology Corporation с 2006 по 2026
P/E на конец каждого года
| Год | P/E коэффициент | Изменить |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
P/E для схожих компаний или конкурентов
| Компания | P/E Ratio | Разница P/E | Страна |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
Как читать P/E Ratio?
Коэффициент цена/прибыль (P/E Ratio) отражает соотношение между ценой акции компании и её прибылью на акцию.
Низкий, но положительный P/E говорит о том, что компания приносит высокую прибыль при низкой оценке и может быть недооценена. Высокий отрицательный (близкий к 0) P/E указывает на значительные убытки.
Компании с P/E выше 30 или отрицательным считаются "акциями роста" — инвесторы ожидают роста или будущей прибыли.
Компании с положительным P/E ниже 10 считаются "ценностными акциями", т.е. уже прибыльны, но с низким потенциалом роста.