LB Semicon, Inc.
061970
Ранг среди акций
#18889
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Цена акции
$2.37
Рыночная капитализация
$166.07M
Изменение (1 день)
2.60%
Изменение (1 год)
-36.00%
Страна
KR
Торговля LB Semicon, Inc. (061970)
Категория
Technology
История цены акций LB Semicon, Inc. (061970)
Наивысшая цена закрытия: $2.80 2026-10-01
Наименьшая цена закрытия: $4.06 2011-01-01
Наименьшая цена закрытия: $4.06 2011-01-01
История цены акций LB Semicon, Inc. с 2011 по 2026
Годовая динамика цены акций
| Год | Результативность |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Цена акций похожих компаний или конкурентов
| Компания | Цена акций | Изменение 1г% | Страна |
|---|---|---|---|
| $212.89 | 18.09% |
US
|
|
| $73.94 | 55.79% |
TW
|
|
| $325.42 | -4.37% |
US
|
|
| $863.13 | 334.89% |
US
|
|
| $511.13 | 122.01% |
US
|
