LB Semicon, Inc.
061970
Ранг среди акций
#19176
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Цена акции
$2.30
Рыночная капитализация
$161.37M
Изменение (1 день)
-5.13%
Изменение (1 год)
-40.30%
Страна
KR
Торговля LB Semicon, Inc. (061970)
Категория
Technology
EPS для LB Semicon, Inc. (061970)
EPS по состоянию на 2026 TTM: 0
Согласно последним финансовым отчетам и цене акций LB Semicon, Inc., текущий EPS компании (TTM) составляет 0. В конце 2026 EPS компании составлял 0, равна показателю 2026 года, равному 0.
История EPS компании LB Semicon, Inc. с 2026 по 2026
EPS на конец каждого года
| Год | EPS | Изменить |
|---|---|---|
| Недостаточно данных для указанных дат. | ||
EPS для аналогичных компаний или конкурентов
| Компания | EPS | Разница в EPS | Страна |
|---|---|---|---|
| $7.95 | - |
US
|
|
| $2.74 | - |
TW
|
|
| $8.06 | - |
US
|
|
| $75.31 | - |
US
|
|
| $3.94 | - |
US
|
