Chipbond Technology Corporation
6147
Rang în acțiuni
#3491
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Preț acțiune
$6.63
Ultima sincronizare: 2026-10-19
Capitalizare de piață
$4.94B
Schimbare (1 zi)
0.24%
Schimbare (1 an)
249.26%
Țară
TW
Tranzacționează Chipbond Technology Corporation (6147)
Categorie
Technology
Număr de acțiuni în circulație pentru Chipbond Technology Corporation (6147)
Număr de acțiuni în circulație la data de June 2026: 741.76M
Conform celor mai recente rapoarte financiare și prețului acțiunilor Chipbond Technology Corporation, numărul curent de acțiuni în circulație este 741.76M. La sfârșitul anului December 2023, compania avea 738.38M acțiuni în circulație. Numărul de acțiuni în circulație este de obicei influențat de splituri de acțiuni și programe de răscumpărare.
Istoricul acțiunilor în circulație pentru Chipbond Technology Corporation (6147) din 2006 până în 2026
Acțiuni în circulație la sfârșitul fiecărui an
| An | Acțiuni în circulație | Schimbă |
|---|---|---|
| 2026 (TTM) | 741.76M | 0.32% |
| 2024 | 739.42M | 0.14% |
| 2023 | 738.38M | -0.04% |
| 2022 | 738.68M | 8.31% |
| 2021 | 682.01M | 4.43% |
| 2020 | 653.07M | 0.27% |
| 2019 | 651.34M | 0.23% |
| 2018 | 649.84M | 0.09% |
| 2017 | 649.26M | 0.00% |
| 2016 | 649.26M | 0.30% |
| 2015 | 647.31M | 0.31% |
| 2014 | 645.31M | 6.79% |
| 2013 | 604.31M | 2.58% |
| 2012 | 589.09M | -0.37% |
| 2011 | 591.26M | 13.05% |
| 2010 | 523.02M | 66.82% |
| 2009 | 313.52M | -1.63% |
| 2008 | 318.70M | -0.58% |
| 2007 | 320.56M | 4.69% |
| 2006 | 306.22M | 0.00% |
Acțiuni în circulație pentru companii similare sau concurente
| Companie | Acțiuni în circulație | Diferență | Țara |
|---|---|---|---|
| 24.19B | 3,161.15% |
US
|
|
| 25.93B | 3,395.69% |
TW
|
|
| 4.77B | 542.52% |
US
|
|
| 1.13B | 52.34% |
US
|
|
| 1.63B | 119.88% |
US
|
