Chipbond Technology Corporation
6147
Rang în acțiuni
#3583
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Preț acțiune
$6.41
Capitalizare de piață
$4.77B
Schimbare (1 zi)
-3.36%
Schimbare (1 an)
237.54%
Țară
TW
Tranzacționează Chipbond Technology Corporation (6147)
Categorie
Technology
Raport P/E pentru Chipbond Technology Corporation (6147)
Raport P/E la data de October 2026 TTM: 51.56
Conform celor mai recente rapoarte financiare și prețului acțiunilor Chipbond Technology Corporation, raportul P/E actual (TTM) este 51.56. La sfârșitul anului 2023, compania avea un P/E de 13.36.
Istoricul raportului P/E pentru Chipbond Technology Corporation din 2006 până în 2026
Raportul P/E la sfârșitul fiecărui an
| An | Raport P/E | Schimbă |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
Raportul P/E pentru companii similare sau concurenți
| Companie | P/E Ratio | Diferență P/E Ratio | Țara |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
Cum interpretezi un P/E ratio?
Raportul Preț/Câștig (P/E Ratio) măsoară relația dintre prețul acțiunii unei companii și câștigul pe acțiune.
Un P/E scăzut dar pozitiv indică o companie cu profituri mari în raport cu evaluarea actuală și ar putea fi subevaluată. Un P/E negativ mare (aproape de 0) indică pierderi majore.
Companiile cu un P/E peste 30 sau negativ sunt considerate în general „acțiuni de creștere”, adică investitorii se așteaptă la creștere sau profitabilitate viitoare.
Companiile cu un P/E pozitiv sub 10 sunt considerate „acțiuni de valoare”, adică sunt deja profitabile, dar cu șanse mici de creștere suplimentară.