Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

Rang în acțiuni #1334
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Preț acțiune
$31.96
Capitalizare de piață
$16.84B
Schimbare (1 zi)
6.35%
Schimbare (1 an)
554.04%
Țară
TW
Tranzacționează Kinsus Interconnect Technology Corp. (3189)

Categorie

Technology
Venituri pentru Kinsus Interconnect Technology Corp. (3189)
Venituri în Jun 2026 TTM: $1.42B
Conform celor mai recente rapoarte financiare ale Kinsus Interconnect Technology Corp., venitul actual al companiei (TTM) este $1.42B. În anul 2024, compania a avut un venit de $930.32M o creștere față de venitul din anul 2023, care a fost de $874.48M. Venitul reprezintă suma totală generată de o companie din vânzarea de bunuri sau servicii. Spre deosebire de profit, cheltuielile nu sunt scăzute.
Istoricul veniturilor pentru Kinsus Interconnect Technology Corp. din 2004 până în 2026
Venituri la sfârșitul fiecărui an
An Venituri Schimbă
2026 (TTM) $1.42B 13.54%
2025 $1.25B 34.77%
2024 $930.32M 6.39%
2023 $874.48M -36.82%
2022 $1.38B 15.08%
2021 $1.20B 24.69%
2020 $964.57M 29.23%
2019 $746.41M -3.80%
2018 $775.92M 3.04%
2017 $753.05M 5.45%
2016 $714.15M 1.93%
2015 $700.64M -10.92%
2014 $786.56M 1.68%
2013 $773.57M 1.98%
2012 $758.55M 0.97%
2011 $751.23M 24.43%
2010 $603.76M 74.19%
2009 $346.61M -6.86%
2008 $372.15M -7.07%
2007 $400.48M 9.61%
2006 $365.38M 86.19%
2005 $196.24M 34.45%
2004 $145.96M 0.00%
Venituri pentru companii similare sau concurente
Companie Venituri Diferență de venituri Țara
$302.97B 21,181.80%
US
$141.20B 9,818.71%
TW
$89.10B 6,159.04%
US
$133.19B 9,255.68%
US
$41.31B 2,801.44%
US