LB Semicon, Inc.
061970
Rang în acțiuni
#19230
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Preț acțiune
$2.35
Capitalizare de piață
$164.52M
Schimbare (1 zi)
2.88%
Schimbare (1 an)
-36.82%
Țară
KR
Tranzacționează LB Semicon, Inc. (061970)
Categorie
Technology
Raport P/S pentru LB Semicon, Inc. (061970)
Raport P/S la data de 2026 TTM: 0
Conform celor mai recente rapoarte financiare și prețului acțiunilor LB Semicon, Inc., raportul P/S actual (TTM) este 0. La sfârșitul anului 2026, compania avea un P/S de 0.
Istoricul raportului P/S pentru LB Semicon, Inc. din 2026 până în 2026
Raport P/S la sfârșitul fiecărui an
| An | Raport P/S | Schimbă |
|---|---|---|
| Nu sunt suficiente date pentru perioada selectată. | ||
Raport P/S pentru companii similare sau competitoare
| Companie | Raport P/S | Diferență raport P/S | Țara |
|---|---|---|---|
| 17.60 | - |
US
|
|
| 14.25 | - |
TW
|
|
| 18.55 | - |
US
|
|
| 7.75 | - |
US
|
|
| 22.53 | - |
US
|
