LB Semicon, Inc.
061970
Rang în acțiuni
#18889
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Preț acțiune
$2.37
Capitalizare de piață
$166.07M
Schimbare (1 zi)
2.60%
Schimbare (1 an)
-36.00%
Țară
KR
Tranzacționează LB Semicon, Inc. (061970)
Categorie
Technology
Istoric al prețului acțiunii pentru LB Semicon, Inc. (061970)
Cel mai mare preț de închidere: $2.80 pe 2026-10-01
Cel mai mic preț de închidere: $4.06 pe 2011-01-01
Cel mai mic preț de închidere: $4.06 pe 2011-01-01
Istoric al prețului acțiunii pentru LB Semicon, Inc. din 2011 până în 2026
Evoluția anuală a prețului acțiunii
| An | Performanță |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Prețul acțiunii pentru companii similare sau concurente
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|---|---|---|---|
| $213.13 | 18.22% |
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| $73.94 | 55.79% |
TW
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|
| $325.00 | -4.50% |
US
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| $864.73 | 335.70% |
US
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| $510.54 | 121.75% |
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