Chipbond Technology Corporation
6147
Classificação em ações
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Preço da ação
$6.61
Última sincronização: 2026-10-16
Valor de mercado
$4.92B
Variação (1 dia)
-2.12%
Variação (1 ano)
253.64%
País
TW
Negociar Chipbond Technology Corporation (6147)
Categoria
Technology
Margem Operacional de Chipbond Technology Corporation (6147)
Margem Operacional em October 2026 TTM: 13.60%
De acordo com os relatórios financeiros mais recentes e o preço das ações da Chipbond Technology Corporation, a margem operacional atual (TTM) é 13.60%. No final de 2023, a margem operacional era 16.58%.
Histórico da Margem Operacional da Chipbond Technology Corporation de 2006 a 2026
Margem Operacional no final de cada ano
| Ano | Margem Operacional | Alterar |
|---|---|---|
| 2026 (TTM) | 13.60% | 8.80% |
| 2024 | 12.50% | -24.61% |
| 2023 | 16.58% | -48.40% |
| 2022 | 32.13% | 16.37% |
| 2021 | 27.61% | 36.82% |
| 2020 | 20.18% | -22.53% |
| 2019 | 26.05% | 25.06% |
| 2018 | 20.83% | 20.40% |
| 2017 | 17.30% | 7.79% |
| 2016 | 16.05% | 6.22% |
| 2015 | 15.11% | -10.96% |
| 2014 | 16.97% | -0.82% |
| 2013 | 17.11% | -20.53% |
| 2012 | 21.53% | 29.00% |
| 2011 | 16.69% | -28.03% |
| 2010 | 23.19% | 192.80% |
| 2009 | 7.92% | 28.57% |
| 2008 | 6.16% | -69.18% |
| 2007 | 19.99% | 30.82% |
| 2006 | 15.28% | 0.00% |
Margem Operacional de empresas semelhantes ou concorrentes
| Empresa | Margem Operacional | Diferença na Margem Operacional | País |
|---|---|---|---|
| 65.21% | -95.21% |
US
|
|
| 56.04% | -95.88% |
TW
|
|
| 48.36% | -96.44% |
US
|
|
| 75.01% | -94.48% |
US
|
|
| 15.71% | -98.84% |
US
|
O que é a Margem Operacional de uma empresa?
A Margem Operacional é um indicador essencial para avaliar a rentabilidade de uma empresa. Margens operacionais mais altas geralmente são melhores, pois mostram que uma empresa consegue vender seus produtos ou serviços por muito mais do que o custo de produzi-los. É calculada dividindo os lucros da empresa pela sua receita.