HPSP Co., Ltd. HPSP Co., Ltd.

HPSP Co., Ltd.

403870

Classificação em ações #5119
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Preço da ação
$34.57
Valor de mercado
$2.81B
Variação (1 dia)
-4.58%
Variação (1 ano)
35.51%
País
KR
Negociar HPSP Co., Ltd. (403870)

Categoria

Technology
Histórico de dividendos de HPSP Co., Ltd. (403870)
HPSP Co., Ltd. (símbolo da ação: 403870) realizou um total de 4 pagamentos de dividendos.
A soma de todos os dividendos (ajustada para desdobramentos de ações) é: $937.50
Rendimento de dividendos (TTM): 0.012
Pagamentos de dividendos de HPSP Co., Ltd. (403870) de 2022 a 2026
Pagamentos anuais de dividendos
Ano Dividendo (ajustado para desdobramentos) Alterar
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -75.00%
2022 $150.00 0.00%
Lista de todos os pagamentos de dividendos
Ano Dividendo Alterar
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -93.75%
2022 $600.00 0.00%
Dividendos de empresas semelhantes ou concorrentes