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ThinTech Materials Technology Co., Ltd. ThinTech Materials Technology Co., Ltd.

ThinTech Materials Technology Co., Ltd.

3663
Classificação em ações #17951
ThinTech Materials Technology Co., Ltd., founded in 1989 and headquartered in... ThinTech Materials Technology Co., Ltd., founded in 1989 and headquartered in Kaohsiung, Taiwan, operates globally as a developer, manufacturer, and seller of sophisticated alloys and optoelectronic materials. The company offers a diverse range of high-performance materials, with a particular focus on sputtering targets essential for various advanced applications. These include planar and rotary flat panel displays, optical data storage, decorative and functional coatings, passive components, optical elements, and semiconductor fabrication. Additionally, ThinTech supplies specialized thin film targets for solar cell manufacturing and nickel alloy C-hooks used in coil wire pickling processes. Beyond its material products, ThinTech provides comprehensive services such as sputtering target bonding, metal refining and sales, and analytical support. Their product portfolio also features metal powders suitable for 3D printing, robust acid and alkali-resistant alloys, and high-quality titanium for cookware and dining implements. Furthermore, the company markets consumer-oriented titanium products, including pots, bowl sets, cups, chopsticks, bento boxes, spoons, and forks.
Preço da ação
$1.96
Valor de mercado
$212.87M
Variação (1 dia)
-1.12%
Variação (1 ano)
11.47%
País
TW
Negociar ThinTech Materials Technology Co., Ltd. (3663)

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Histórico de desdobramentos de ações de ThinTech Materials Technology Co., Ltd. (3663)
As ações ThinTech Materials Technology Co., Ltd. (símbolo: 3663) passaram por um total de 0 desdobramentos.
O desdobramento mais recente ocorreu em Sep 03, 2026.
Uma ação 3663 comprada antes de Sep 03, 2026 equivaleria hoje a 0 ações 3663.
Lista de desdobramentos de ações
Ano Desdobramento Multiplicador Multiplicador cumulativo
Não há dados suficientes para as datas fornecidas.
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