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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Classificação em ações #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Preço da ação
$0.48016532
Última sincronização: 2026-08-21
Valor de mercado
$87.70M
Variação (1 dia)
1.34%
Variação (1 ano)
11.79%
País
TW
Negociar Taiwan IC Packaging Corporation (3372)

Categoria

Technology
Histórico de rendimento de dividendos para Taiwan IC Packaging Corporation (3372)
O rendimento de dividendos (TTM) da Taiwan IC Packaging Corporation (símbolo da ação: 3372) em 2026 é: 0
Rendimento médio dos dividendos nos últimos 5 anos: 0.00%
Histórico de rendimento de dividendos para Taiwan IC Packaging Corporation (3372) de 2026 a 2026
Rendimento de dividendos no final de cada ano (TTM)
Ano Rendimento de Dividendos Alterar
Não há dados suficientes para as datas fornecidas.
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