LB Semicon, Inc.
061970
Classificação em ações
#18890
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Preço da ação
$2.37
Valor de mercado
$166.07M
Variação (1 dia)
2.60%
Variação (1 ano)
-36.00%
País
KR
Negociar LB Semicon, Inc. (061970)
Categoria
Technology
Histórico de preços das ações de LB Semicon, Inc. (061970)
Preço de fecho mais alto: $2.80 em 2026-10-01
Preço de fecho mais baixo: $4.06 em 2011-01-01
Preço de fecho mais baixo: $4.06 em 2011-01-01
Histórico de preços das ações da LB Semicon, Inc. de 2011 a 2026
Desempenho anual do preço das ações
| Ano | Desempenho |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Preço das ações de empresas similares ou concorrentes
| Empresa | Preço da ação | Variação 1a% | País |
|---|---|---|---|
| $213.41 | 18.37% |
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| $73.94 | 55.79% |
TW
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|
| $322.64 | -5.19% |
US
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| $872.72 | 339.72% |
US
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| $510.83 | 121.88% |
US
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