LB Semicon, Inc.
061970
Classificação em ações
#19101
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Preço da ação
$2.33
Valor de mercado
$163.31M
Variação (1 dia)
2.12%
Variação (1 ano)
-37.29%
País
KR
Negociar LB Semicon, Inc. (061970)
Categoria
Technology
Rácio P/B de LB Semicon, Inc. (061970)
Rácio P/B em 2026 TTM: 0
De acordo com os relatórios financeiros mais recentes e o preço das ações da LB Semicon, Inc., o rácio P/B atual (TTM) é 0. No final de 2026, o rácio P/B era 0.
Histórico do rácio P/B da LB Semicon, Inc. de 2026 a 2026
Rácio P/B no final de cada ano
| Ano | Rácio P/B | Alterar |
|---|---|---|
| Não há dados suficientes para as datas fornecidas. | ||
Rácio P/B de empresas semelhantes ou concorrentes
| Empresa | Rácio P/B | Diferença do rácio P/B | País |
|---|---|---|---|
| 23.3783 | - |
US
|
|
| 9.8357 | - |
TW
|
|
| 16.5536 | - |
US
|
|
| 7.4648 | - |
US
|
|
| 13.8493 | - |
US
|
