HANMI Semiconductor Co., Ltd. HANMI Semiconductor Co., Ltd.

HANMI Semiconductor Co., Ltd.

042700

Classificação em ações #1626
Headquartered in Incheon, South Korea, and established in 1980, HANMI... Headquartered in Incheon, South Korea, and established in 1980, HANMI Semiconductor Co., Ltd. is a global provider of advanced semiconductor manufacturing equipment, serving markets both domestically and internationally. The company's extensive product line includes specialized vision-based placement systems and a comprehensive suite of bonding solutions, such as flip chip, TSV dual stacking, TC, jumbo panel flip chip, and die flip chip bonders. HANMI also supplies comprehensive EMI shielding apparatus, encompassing vision-guided attach/detach, precise placement, tape mounting, laser cutting, demounting, and dedicated vision inspection, alongside converlay attach systems. Furthermore, their offerings extend to various testing and handling instruments like power ECU automation, test handlers, vision-enabled placement, trimming, forming, singulation, and sophisticated 3D vision inspection tools. The company manufactures diverse molding equipment, encompassing automated, compression, mechanical, and hydraulic presses. They also provide cutting-edge laser processing solutions, including general and wafer laser marking, ablation, and precise laser cutting/deflash machinery. Completing their portfolio are specialized tools such as cam press trim and form, micro cam press, CSP singulation, pick-and-place, die sorters, strip mounters, and additional testing apparatus.
Preço da ação
$139.68
Valor de mercado
$13.25B
Variação (1 dia)
1.05%
Variação (1 ano)
33.68%
País
KR
Negociar HANMI Semiconductor Co., Ltd. (042700)

Categoria

Technology
Histórico de dividendos de HANMI Semiconductor Co., Ltd. (042700)
HANMI Semiconductor Co., Ltd. (símbolo da ação: 042700) realizou um total de 22 pagamentos de dividendos.
A soma de todos os dividendos (ajustada para desdobramentos de ações) é: $4.51K
Rendimento de dividendos (TTM): 0.0083
Pagamentos de dividendos de HANMI Semiconductor Co., Ltd. (042700) de 2005 a 2026
Pagamentos anuais de dividendos
Ano Dividendo (ajustado para desdobramentos) Alterar
2026 (TTM) $800.00 -47.37%
2025 $1,520.00 261.90%
2024 $420.00 110.00%
2022 $200.00 -33.33%
2021 $300.00 50.00%
2020 $200.00 300.00%
2019 $50.00 -60.00%
2018 $125.00 4.17%
2017 $120.00 20.00%
2016 $100.00 0.00%
2015 $100.00 0.00%
2014 $100.00 0.00%
2013 $100.00 0.00%
2012 $100.00 400.00%
2011 $20.00 -80.00%
2010 $100.00 400.00%
2009 $20.00 0.00%
2008 $20.00 -33.33%
2007 $30.00 -37.00%
2006 $47.62 34.92%
2005 $35.29 0.00%
Lista de todos os pagamentos de dividendos
Ano Dividendo Alterar
2026 (TTM) $800.00 -47.37%
2025 $1,520.00 261.90%
2024 $420.00 110.00%
2022 $200.00 -66.67%
2021 $600.00 50.00%
2020 $400.00 300.00%
2019 $100.00 -60.00%
2018 $250.00 4.17%
2017 $240.00 -80.80%
2016 $1,250.00 0.00%
2015 $1,250.00 0.00%
2014 $1,250.00 0.00%
2013 $1,250.00 0.00%
2012 $1,250.00 400.00%
2011 $250.00 -80.00%
2010 $1,250.00 400.00%
2009 $250.00 0.00%
2008 $250.00 -36.51%
2007 $393.75 -37.00%
2006 $625.00 -16.67%
2005 $750.00 0.00%
Dividendos de empresas semelhantes ou concorrentes