Chipbond Technology Corporation
6147
Pozycja w akcjach
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Cena akcji
$6.61
Ostatnia synchronizacja: 2026-10-16
Kapitalizacja rynkowa
$4.92B
Zmiana (1 dzień)
-2.12%
Zmiana (1 rok)
253.64%
Kraj
TW
Handel Chipbond Technology Corporation (6147)
Kategoria
Technology
Marża operacyjna dla Chipbond Technology Corporation (6147)
Marża operacyjna na dzień October 2026 TTM: 13.60%
Według najnowszych raportów finansowych i ceny akcji Chipbond Technology Corporation, bieżąca marża operacyjna (TTM) wynosi 13.60%. Na koniec 2023 wynosiła 16.58%.
Historia marży operacyjnej dla Chipbond Technology Corporation od 2006 do 2026
Marża operacyjna na koniec każdego roku
| Rok | Marża operacyjna | Zmień |
|---|---|---|
| 2026 (TTM) | 13.60% | 8.80% |
| 2024 | 12.50% | -24.61% |
| 2023 | 16.58% | -48.40% |
| 2022 | 32.13% | 16.37% |
| 2021 | 27.61% | 36.82% |
| 2020 | 20.18% | -22.53% |
| 2019 | 26.05% | 25.06% |
| 2018 | 20.83% | 20.40% |
| 2017 | 17.30% | 7.79% |
| 2016 | 16.05% | 6.22% |
| 2015 | 15.11% | -10.96% |
| 2014 | 16.97% | -0.82% |
| 2013 | 17.11% | -20.53% |
| 2012 | 21.53% | 29.00% |
| 2011 | 16.69% | -28.03% |
| 2010 | 23.19% | 192.80% |
| 2009 | 7.92% | 28.57% |
| 2008 | 6.16% | -69.18% |
| 2007 | 19.99% | 30.82% |
| 2006 | 15.28% | 0.00% |
Marża operacyjna dla podobnych firm lub konkurentów
| Firma | Marża operacyjna | Różnica w marży operacyjnej | Kraj |
|---|---|---|---|
| 65.21% | -95.21% |
US
|
|
| 56.04% | -95.88% |
TW
|
|
| 48.36% | -96.44% |
US
|
|
| 75.01% | -94.48% |
US
|
|
| 15.71% | -98.84% |
US
|
Czym jest marża operacyjna firmy?
Marża operacyjna to kluczowy wskaźnik do oceny rentowności firmy. Wyższe marże operacyjne są zazwyczaj korzystniejsze, ponieważ pokazują, że firma może sprzedawać swoje produkty lub usługi znacznie drożej niż koszty ich produkcji. Oblicza się ją, dzieląc zysk firmy przez jej przychody.