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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
Pozycja w akcjach #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
Cena akcji
$5.93
Ostatnia synchronizacja: 2026-08-28
Kapitalizacja rynkowa
$808.10M
Zmiana (1 dzień)
5.67%
Zmiana (1 rok)
76.93%
Kraj
TW
Handel Winstek Semiconductor Co., Ltd. (3265)

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Historia stopy dywidendy dla Winstek Semiconductor Co., Ltd. (3265)
Stopa dywidendy (TTM) dla Winstek Semiconductor Co., Ltd. (symbol akcji: 3265) na dzień 2026 wynosi: 0
Średnia stopa dywidendy z ostatnich 5 lat: 0.00%
Historia stopy dywidendy dla Winstek Semiconductor Co., Ltd. (3265) od 2026 do 2026
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