LB Semicon, Inc.
061970
Pozycja w akcjach
#19236
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Cena akcji
$2.28
Kapitalizacja rynkowa
$159.92M
Zmiana (1 dzień)
-5.98%
Zmiana (1 rok)
-40.84%
Kraj
KR
Handel LB Semicon, Inc. (061970)
Kategoria
Technology
Wskaźnik P/S dla LB Semicon, Inc. (061970)
Wskaźnik P/S na dzień 2026 TTM: 0
Według najnowszych raportów finansowych i ceny akcji LB Semicon, Inc., obecny wskaźnik P/S (TTM) wynosi 0. Na koniec 2026 wynosił 0.
Historia wskaźnika P/S dla LB Semicon, Inc. od 2026 do 2026
Wskaźnik P/S na koniec każdego roku
| Rok | Wskaźnik P/S | Zmień |
|---|---|---|
| Za mało danych dla podanych dat. | ||
Wskaźnik P/S dla podobnych firm lub konkurentów
| Firma | Wskaźnik P/S | Różnica wskaźnika P/S | Kraj |
|---|---|---|---|
| 17.60 | - |
US
|
|
| 14.25 | - |
TW
|
|
| 18.55 | - |
US
|
|
| 7.75 | - |
US
|
|
| 22.53 | - |
US
|
