LB Semicon, Inc.
061970
Pozycja w akcjach
#18925
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Cena akcji
$2.43
Kapitalizacja rynkowa
$170.10M
Zmiana (1 dzień)
-2.36%
Zmiana (1 rok)
-36.10%
Kraj
KR
Handel LB Semicon, Inc. (061970)
Kategoria
Technology
EPS dla LB Semicon, Inc. (061970)
EPS na dzień 2026 TTM: 0
Według najnowszych raportów finansowych i ceny akcji firmy LB Semicon, Inc., obecny EPS (TTM) wynosi 0. Na koniec roku 2026 firma miała EPS w wysokości 0, równa się do EPS z roku 2026, który wynosił 0.
Historia EPS dla LB Semicon, Inc. od 2026 do 2026
EPS na koniec każdego roku
| Rok | EPS | Zmień |
|---|---|---|
| Za mało danych dla podanych dat. | ||
EPS dla podobnych firm lub konkurentów
| Firma | EPS | Różnica w EPS | Kraj |
|---|---|---|---|
| $7.95 | - |
US
|
|
| $2.74 | - |
TW
|
|
| $8.06 | - |
US
|
|
| $75.31 | - |
US
|
|
| $3.94 | - |
US
|
