LB Semicon, Inc.
061970
Pozycja w akcjach
#19231
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Cena akcji
$2.28
Kapitalizacja rynkowa
$159.92M
Zmiana (1 dzień)
-5.98%
Zmiana (1 rok)
-40.84%
Kraj
KR
Handel LB Semicon, Inc. (061970)
Kategoria
Technology
Historia stopy dywidendy dla LB Semicon, Inc. (061970)
Stopa dywidendy (TTM) dla LB Semicon, Inc. (symbol akcji: 061970) na dzień 2026 wynosi: 0
Średnia stopa dywidendy z ostatnich 5 lat: 0.00%
Średnia stopa dywidendy z ostatnich 5 lat: 0.00%
Historia stopy dywidendy dla LB Semicon, Inc. (061970) od 2026 do 2026
Stopa dywidendy na koniec każdego roku (TTM)
| Rok | Stopa dywidendy | Zmień |
|---|---|---|
| Za mało danych dla podanych dat. | ||
Stopy dywidendy (TTM) dla podobnych firm lub konkurencji
| Firma | Stopa dywidendy | Kraj |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
