Amkor Technology, Inc. Amkor Technology, Inc.

Amkor Technology, Inc.

AMKR

Rangering i aksjer #2001
Amkor Technology, Inc. operates internationally, delivering external... Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Aksjekurs
$41.97
Sist synkronisert: 2026-10-20
Markedsverdi
$10.43B
Endring (1 dag)
0.19%
Endring (1 år)
30.54%
Land
US
Handel Amkor Technology, Inc. (AMKR)

Kategori

Technology
Inntekter for Amkor Technology, Inc. (AMKR)
Inntekter i Jun 2026 TTM: $7.46B
Ifølge de nyeste økonomiske rapportene til Amkor Technology, Inc. er selskapets nåværende inntekter (TTM) $7.46B. I 2024 hadde selskapet inntekter på $6.32B en nedgang sammenlignet med inntektene i 2023, som var $6.50B. Inntektene er det totale beløpet et selskap genererer fra salg av varer eller tjenester. I motsetning til fortjeneste trekkes ingen kostnader fra.
Inntektshistorikk for Amkor Technology, Inc. fra 2000 til 2026
Inntekter ved slutten av hvert år
År Inntekter Endre
2026 (TTM) $7.46B 11.18%
2025 $6.71B 6.18%
2024 $6.32B -2.85%
2023 $6.50B -8.30%
2022 $7.09B 15.53%
2021 $6.14B 21.54%
2020 $5.05B 24.62%
2019 $4.05B -6.11%
2018 $4.32B 3.10%
2017 $4.19B 7.52%
2016 $3.89B 34.98%
2015 $2.88B -7.82%
2014 $3.13B 5.85%
2013 $2.96B 7.12%
2012 $2.76B -0.59%
2011 $2.78B -5.55%
2010 $2.94B 34.89%
2009 $2.18B -18.04%
2008 $2.66B -2.95%
2007 $2.74B 0.40%
2006 $2.73B 29.93%
2005 $2.10B 10.45%
2004 $1.90B 18.55%
2003 $1.60B -2.19%
2002 $1.64B 8.03%
2001 $1.52B -36.42%
2000 $2.39B 0.00%
Inntekter for lignende selskaper eller konkurrenter
Selskap Inntekter Forskjell i inntekter Land
$302.97B 3,962.51%
US
$141.20B 1,793.39%
TW
$89.10B 1,094.80%
US
$133.19B 1,685.92%
US
$41.31B 453.86%
US