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Tema
Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Rangering i aksjer #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Aksjekurs
$0.48016532
Sist synkronisert: 2026-08-21
Markedsverdi
$87.70M
Endring (1 dag)
1.34%
Endring (1 år)
11.79%
Land
TW
Handel Taiwan IC Packaging Corporation (3372)

Kategori

Technology
Historikk for aksjesplitt for Taiwan IC Packaging Corporation (3372)
Aksjen Taiwan IC Packaging Corporation (symbol: 3372) har gjennomgått totalt 0 aksjesplitt.
Den nyeste splittelsen skjedde Aug 23, 2026.
Én 3372-aksje kjøpt før Aug 23, 2026 tilsvarer i dag 0 3372-aksjer.
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