Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

Rangering i aksjer #1396
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Aksjekurs
$31.32
Markedsverdi
$16.50B
Endring (1 dag)
4.23%
Endring (1 år)
541.02%
Land
TW
Handel Kinsus Interconnect Technology Corp. (3189)

Kategori

Technology
Antall utestående aksjer for Kinsus Interconnect Technology Corp. (3189)
Antall utestående aksjer per June 2026: 655.65M
Ifølge Kinsus Interconnect Technology Corp. sine siste økonomiske rapporter og aksjekurs er antall utestående aksjer nå 655.65M. Ved slutten av December 2024 hadde selskapet 453.76M utestående aksjer. Antallet utestående aksjer påvirkes vanligvis av aksjesplitt og tilbakekjøp.
Historikk over utestående aksjer for Kinsus Interconnect Technology Corp. (3189) fra 2004 til 2026
Utestående aksjer ved utgangen av hvert år
År Utestående aksjer Endre
2026 (TTM) 655.65M 44.02%
2025 455.24M 0.33%
2024 453.76M -4.50%
2023 475.16M 2.64%
2022 462.96M 14.73%
2021 403.53M -10.64%
2020 451.60M 0.81%
2019 447.96M -0.02%
2018 448.06M 0.24%
2017 446.98M -0.95%
2016 451.25M -0.86%
2015 455.16M 0.41%
2014 453.30M 0.11%
2013 452.82M -0.04%
2012 453.01M 1.57%
2011 446.00M 0.00%
2010 446.00M 0.00%
2009 446.00M 0.00%
2008 446.00M 0.00%
2007 446.00M 8.44%
2006 411.30M 19.34%
2005 344.64M 5.72%
2004 325.98M 0.00%
Utestående aksjer for lignende selskaper eller konkurrenter
Selskap Utestående aksjer Forskjell Land
24.19B 3,589.48%
US
25.93B 3,854.83%
TW
4.77B 626.91%
US
1.13B 72.35%
US
1.63B 148.76%
US