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Nextronics Engineering Corp. Nextronics Engineering Corp.

Nextronics Engineering Corp.

8147
Rang in aandelen #19411
Nextronics Engineering Corp., founded in 1986 and headquartered in New Taipei... Nextronics Engineering Corp., founded in 1986 and headquartered in New Taipei City, Taiwan, is a specialized supplier of electronic components. The company provides a comprehensive range of connectors, thermal management products, backplanes, and subracks. These offerings cater to demanding applications across diverse sectors, including medical, aerospace, transportation, industrial, and communications. Its product lineup encompasses various connector types, such as high-speed I/O, circular, backplane signal, and combination power connectors, in addition to terminal blocks. Nextronics also furnishes specialized connectors and components tailored for embedded systems. Beyond these core products, the firm supplies press-fit machines and tooling. A significant aspect of its operations involves delivering custom-engineered solutions, which include bespoke high-speed, circular, RF coax, D-shaped, rectangular, and automotive connectors, as well as customized embedded systems. The company further provides integrated product solutions adhering to standards like Compact PCI, ATCA, AMC, and Micro TCA. All products are marketed under the company's proprietary NEXTRON brand.
Aandeelprijs
$3.97
Marktkapitalisatie
$165.49M
Verandering (1 dag)
4.17%
Verandering (1 jaar)
5.64%
Land
TW
Handel Nextronics Engineering Corp. (8147)

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Aandelsplitsingen voor Nextronics Engineering Corp. (8147)
Het aandeel Nextronics Engineering Corp. (symbool: 8147) heeft in totaal 0 splitsingen ondergaan.
De meest recente splitsing vond plaats op Aug 26, 2026.
Eén aandeel 8147 dat vóór Aug 26, 2026 werd gekocht, staat nu gelijk aan 0 aandelen 8147.
Lijst van aandelen splitsingen
Jaar Splitsing Vermenigvuldiging Cumulatieve vermenigvuldiging
Niet genoeg gegevens voor de verstrekte datums.
Aandelsplitsingen van vergelijkbare bedrijven of concurrenten
Bedrijf Aantal aandelen splitsingen Cumulatieve vermenigvuldiging Land
7 x127
US
0 -
JP
15 x3
TW
5 x60
US
28 x109
TW