Shenzhen Kinwong Electronic Co., Ltd. Shenzhen Kinwong Electronic Co., Ltd.

Shenzhen Kinwong Electronic Co., Ltd.

603228

Rang in aandelen #1641
Shenzhen Kinwong Electronic Co., Ltd. operates globally, focusing on the... Shenzhen Kinwong Electronic Co., Ltd. operates globally, focusing on the innovation, production, and sale of advanced printed circuit boards (PCBs) and electronic components. Their comprehensive product portfolio features standard PCBs, including single-sided, double-sided, and multi-layered variants. They also manufacture metal-core PCBs utilizing materials such as copper, aluminum, stainless steel, and iron, alongside flexible PCBs available in single-sided, double-sided, and multilayer configurations. Furthermore, the company provides specialized solutions like high-density interconnect (HDI) PCBs, RF microwave PCBs, rigid-flex PCBs, high layer count PCBs, and integrated copper inlays. In addition to manufacturing, Kinwong offers expert engineering and design services. Their market reach is extensive, serving industries such as automotive, smart devices, consumer electronics, power management, telecommunications, industrial and medical technology, and computing. Established in 1993 and based in Shenzhen, China, the company was formerly part of Kinwong Group Limited.
Aandeelprijs
$13.04
Marktkapitalisatie
$13.07B
Verandering (1 dag)
1.83%
Verandering (1 jaar)
50.07%
Land
CN
Handel Shenzhen Kinwong Electronic Co., Ltd. (603228)

Categorie

Technology
Aandelsplitsingen voor Shenzhen Kinwong Electronic Co., Ltd. (603228)
Het aandeel Shenzhen Kinwong Electronic Co., Ltd. (symbool: 603228) heeft in totaal 2 splitsingen ondergaan.
De meest recente splitsing vond plaats op May 26, 2020.
Eén aandeel 603228 dat vóór May 16, 2019 werd gekocht, staat nu gelijk aan 1.96 aandelen 603228.
Lijst van aandelen splitsingen
Jaar Splitsing Vermenigvuldiging Cumulatieve vermenigvuldiging
2020-05-26 7:5 x1.4 x1.96
2019-05-16 7:5 x1.4 x1.4
Aandelsplitsingen van vergelijkbare bedrijven of concurrenten
Bedrijf Aantal aandelen splitsingen Cumulatieve vermenigvuldiging Land
7 x127
US
0 -
JP
15 x3
TW
5 x60
US
28 x109
TW